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GSP 103: Thermal Processes Overview

Course Description

This class is designed to help students to understand the thermal processes in semiconductor manufacturing. The purpose of this course is to present thermal processes including oxidation, diffusion, annealing, alloying, reflow, and deposition. Rapid thermal process (RTP) is also described in this course. This course is designed for industry, government, and university personnel who need knowledge, awareness and working familiarity thermal processes and its position in semiconductor fabrication process.

Course Objectives

  • Introduce the application of thermal processes in semiconductor manufacturing
  • Familiar with the components of thermal process tools
  • Provide introduction of the process sequence of the thermal processes

Who Should Attend?

Technicians, engineers and scientists working in or providing service to the thermal processes in semiconductor industry; executive management, administration, sales and marketing personnel. Suppliers of equipment and materials and individuals desiring to understand semiconductors thermal processes and its development trends are encouraged to attend. Science, engineering, technology, or equivalent training and/or experience is desirable but not required.


Course Length: 1 day

Course Materials: Course Notes

Instructor: Hong Xiao


Course Outline

  • Introduction
Processes, brief history
  • Hardware
Furnaces and RTP systems
  • Thermal oxidation
Applications, growth model, growth rate, wet and dry, pre-oxidation clean and oxidation processes.

  • Diffusion
Application, process
  • Thermal annealing
Post-implantation annealing, purpose, process, RTA Alloy annealing, application Reflow, application
  • High temperature CVD
Epi, application, process Polysilicon, application, process Si3N4, application, process
  • Rapid Thermal Process
Advantages, RTA, RTO, and RTCVD
  • Summary

email C B Yarling
Phone/Fax: 512.292.9189

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