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GSP 101: Semiconductor Manufacturing Process Overview

Course Description

This class is designed to help students to understand the semiconductor manufacturing processes, its history, and its development. The purpose of this course is to present a complete semiconductor fabrication process, including IC design, wafer manufacturing, IC processing technology, and future device and process development trends. Industry, government, and university personnel who need knowledge, awareness and working familiarity with integrated circuit design and manufacturing processes will also benefit from taking this course.

Course Objectives

  • Introduce concepts relating to the design and manufacture of modern IC devices
  • Furnish an understanding of the semiconductor manufacturing process
  • Provide an introduction to future integrated device and process trends

Who Should Attend?

Technicians, engineers and scientists working in or providing equipment or services to the semiconductor manufacturing industry, including executive management, administration, sales and marketing personnel. Suppliers of equipment and materials and individuals desiring to understand semiconductors manufacturing process and its development trends are encouraged to attend. Science, engineering, technology, or equivalent training and/or experience is desirable but not required.

Course Length: 1 day

Course Materials: Course Notes

Instructor: Hong Xiao

Course Topics Outline

  • Semiconductor Device and IC Design: Basic device, MOS and masks, CMOS circuit and masks.
  • Manufacturing Process: Wafer fabrication, epitaxy, thermal process, photolithography, etch, ion implant, dielectric deposition, CMP, and metallization.
  • Tomorrow's Technology: Advanced semiconductor manufacturing process technologies and its future development.

email C B Yarling
Phone/Fax: 512.292.9189

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